IMS MicroApps: Multi-Chip Module Design Challenges

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  • #IMS
  • #IMS 2010
  • #International Microwave Symposium
  • #Microwave
  • #MultiChip
  • #Module Design
  • #Challenges
  • #Dustin Hoekstra
  • #AWR

Dustin Hoekstra of AWR Corporation presents "Multi-Chip Module Design Challenges." As part of IMS 2010, MicroApps seminars from vendors of products and services in the microwave industry help microwave practitioners in learning the latest techniques, skills, and methods.

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  • Published on
  • June 14, 2010

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