3D Power Packaging Made Real with Embedded Component and Substrate Technologies - P.M. Raj, APEC 2018

620 views

IEEE Power Electronics Society

IEEE Industry Applications Society

Create Account or Sign In to post comments

#IEEE #APEC #2018 #Power Electronics #PELS #IAS #PSMA #applied power #engineering #power science

Dr. P.M. Raj, Senior Research Engineer at Georgia Institute of Technology, delivers his keynote presentation on 3D Power Packaging, reliability challenges. Dr. Raj also compares different types of embedding and capacitors.

Visit the APEC website at http://www.apec-conf.org

Dr. P.M. Raj, Senior Research Engineer at Georgia Institute of Technology, delivers his keynote presentation on 3D Power Packaging, reliability challenges. Dr. Raj also compares different types of embedding and capacitors.

Speakers in this video

P. Markondeya Raj

March 7, 2018

Next Up

00:56:26

Using Predictive Engineering for Multiple Response Optimization of an IC

00:33:48

POWERPULSE - A Webinar Session on Power Electronics in Renewable Energy Generation and Electric Vehicle Charging

00:30:40

Surgical Energy: Connecting Power Electronics to Patients – Literally! - APEC 2024

01:20:20

WIE Power at the Table - An Entrepreneur's Career Path to Clean Energy: Fireside Chat with Lunar Energy Founder and CEO Kunal Girotra

02:50:08

IEEE Global Energy Access Workshop - Selected EBL Team Presentations

03:00:12

IEEE Global Energy Access Workshop 2023 Keynotes