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Showing 1 - 1 of 1
01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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Showing 133 - 154 of 160
01:04:59
Electromigration Failure of Solder Interconnects under Non-DC Conditions
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3D Packaging for Superconducting Qubits
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Working Group Meeting 3: 2021 IEEE Heterogeneous Integration Roadmap
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Working Group Meeting 2: 2021 IEEE Heterogeneous Integration Roadmap
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Working Group Meeting 1: 2021 IEEE Heterogeneous Integration Roadmap
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Wrap-up & Charge to the Heterogeneous Integration Roadmap Teams
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How the Semiconductor Research Corporation (SRC) is Leading Research in Packaging
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IEEE Heterogeneous Integration Roadmap: HIR 2020 Retrospective
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IEEE Heterogeneous Integration Roadmap Working Groups: Extended Q&A
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HIR Chiplet Workshop: Architectures and Business Aspects for Heterogeneous Integration
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Wrap-up and Charge to Heterogeneous Integration Roadmap Teams
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01:02:09
Fertilizer on the Farm - Powering the Next Generation of Nitrogen Fixation
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