IEEE HART: Scaling AI with Chiplet-Based Systems - Dr. Tony Chan Carusone

In the rapidly evolving landscape of artificial intelligence, chiplets are emerging as a transformative technology, paving the way for the next generation of AI systems. Chiplets permit the integration of more processing power within a single package and allow for new connectivity solutions so that thousands of AI accelerators can work as a cohesive unit. Optical connectivity, facilitated by chiplets, offers high-speed data transmission with lower power consumption, crucial for handling the massive data loads in AI applications. The emerging chiplet ecosystem, underwritten by high-performance die-to-die interfaces, is throwing open the doors of innovation and facilitating the next wave of AI scaling.

Presented by Dr. Tony Chan Carusone, Qualcomm, University of Toronto