Pascal Reynier - RFIC Industry Showcase - IMS 2021

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Paper Title: A High-Power SOI-CMOS PA Module with Fan-Out Wafer-Level Packaging for 2.4 GHz Wi-Fi 6 Applications

Company: CEA-Leti, France

Paper Authors: P. Reynier1, A. Serhan1, D. Parat1, R. Mourot1, M. Gaye2, P. Kauv2, A. Cardoso3, A. Gouvea3, S. Nogueira3, A. Giry1

Author Affiliations: 1CEA-Leti, France, 2Keysight Technologies, France, 3Amkor Technology, Portugal

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