Semiconductor Packaging Technology: The Future Is Now

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#heterogeneous integration #ic packaging #workforce training #2.5D 3D #Packaging Research Center #GaTech

(48:50 + Q&A)  -- emerging applications, on-shoring, US univ programs in semiconductor packaging, curriculum development, workforce ...   Prof. Madhavan Swaminathan, Director, 3D Systems Packaging Research Center (PRC), Georgia Tech.  Summary: The recent buzz in the semiconductor industry is all about advanced packaging, a heterogeneous platform that enables the integration and miniaturization of systems. With supply chain shortages and most of semiconductor manufacturing being done off-shore, there is a wake-up call by the US government to regain US leadership and competitiveness in this upcoming area. This is a prime opportunity for US universities to step-in and drive innovation, transition these innovations into manufacturing, while creating the next workforce. The fundamental challenge, however, is that few universities in the United States have research and educational programs in semiconductor packaging!
After providing a brief introduction into the reasons why heterogeneous integration using semiconductor packaging is a means to continue Moore’s law, I will present on some of our recent advances and contributions in System on Package (SoP) technologies, a concept that we have been pioneering for almost three decades, that has relevance to emerging applications in Artificial Intelligence, Wireless Communications, Automotive, and Harsh Environments. I will also summarize some of our activities in curriculum development along with a snapshot of the Packaging Research Center, a graduated NSF Engineering Research Center (ERC) currently in its 28th year.

For additional programs from the Dallas EPS Chapter, please visit our website: https://r5.ieee.org/dallas-eps/

(48:50 + Q&A)  -- emerging applications, on-shoring, US univ programs in semiconductor packaging, curriculum development, workforce ...   Prof. Madhavan Swaminathan, Director, 3D Systems Packaging Research Center (PRC), Georgia Tech.  Summary: The recent buzz in the semiconductor industry is all about advanced packaging, a heterogeneous platform that enables the integration and miniaturization of systems. With supply chain shortages and most of semiconductor manufacturing being done off-shore ...

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