Addressing Thermal Challenges for Co-packaging Processes on Glass Substrates

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#glass substrate #reliability #photonics #electronics #advanced packaging #heterogeneous integration

(19:50 + Q&A) - Parnika Gupta, Tyndall National Institute

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

(19:50 + Q&A) - Parnika Gupta, Tyndall National Institute

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

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