Co-Design Methodology for Reliable 3D-Integrated DWDM Silicon Photonics

(24:20 + Q&A) Dr. Jinsung Youn, Hewlett-Packard Enterprise.

To achieve high aggregate bandwidth with lower latency and better energy efficiency, a dense wavelength division multiplexing (DWDM)-based Silicon Photonics (SiPh) is being considered as a key enabler in data centers and high-performance computing system applications. In particular, to develop a reliable DWDM SiPh system, multi-physics design and simulation with electromagnetic, thermal, and optical are strongly required as optical characteristics of thermally-sensitive photonic devices such as ring resonators and photodetectors can be affected. In this talk, we present signal and power integrity (SI/PI) and thermal-aware photonic simulation for a 3D-integrated DWDM SiPh system. 

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