Reliability Challenges of Advanced Silicon Photonics Devices

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#reliability #photonics #electronics #advanced packaging #heterogeneous integration

(39:40 + Q&A) - Dr. Kristof Cores, IMEC

Summary: The development of advanced Silicon Photonics devices imposes two types of reliability challenges that need to be dealt with in parallel. First, there are the so-called technology questions like “how reliable are these devices?”, “what are their safe operation conditions?”, etc. Second, there are the so-called methodology questions like “what are the failure mechanisms”, “what stress factors and stress conditions to apply?”, etc. In this presentation, a few recent understandings on both the technology- and methodology-related questions will be show for Ge PD’s, Ge EAM’s and heaters.

Kristof Croes has an MSc in physics and biostatistics. He obtained a PhD concerning the development of statistical techniques for planning reliability experiments. For seven years, he was product and application manager of the package level reliability products of the Singaporean based company Chiron holdings. Beginning 2007, he went back to research, where he is currently scientific director and group leader of the reliability group working on the reliability of advanced devices, interconnects and packages. Kristof was an (invited/tutorial) speaker at several leading-edge semi-conductor conferences [IEEE International Reliability Physics Symposium (IRPS), IEEE International Interconnect Technology Conference (IITC), and IEEE International Electron Devices Meeting (IEDM)]. He also (co)authored more than 100 articles in the field of reliability.

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

(39:40 + Q&A) - Dr. Kristof Cores, IMEC

Summary: The development of advanced Silicon Photonics devices imposes two types of reliability challenges that need to be dealt with in parallel. First, there are the so-called technology questions like “how reliable are these devices?”, “what are their safe operation conditions?”, etc. Second, there are the so-called methodology questions like “what are the failure mechanisms”, “what stress factors and stress conditions to apply?”, etc. In this presentation, a few recent understandings ...

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