Strain and Surface Warping Detection of Interconnect Microstructures via Laser Diffraction

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#moire #metrology #laser scanning #IC strain #electronics packaging #stress-strain

(27:40 + Q&A) Prof. Hongbin Yu, Arizona State University.  Metrology for determining stress/strain in IC packaging as a result of thermal differential expansion, with fine detail across a chip or device.

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(27:40 + Q&A) Prof. Hongbin Yu, Arizona State University.  Metrology for determining stress/strain in IC packaging as a result of thermal differential expansion, with fine detail across a chip or device.

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