Cross-Layer ESD Protection Designs: Chips, Packaging and Systems

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#ESD #electrostatic discharge #heterogeneous integration #reliability #advanced packaging

(1:00:13 + Q&A) Prof. Albert Wang, ECE, University of California, Riverside (invited lecture at Symp on Reliability of Electronics and Photonics Packaging).  Detailed coverage of application of ESD protection to semiconductor protection for heterogeneous integration.

Albert Wang is a Professor of Electrical and Computer Engineering at University of California, Riverside, USA. He served as a Program Director of National Science Foundation, USA (2018-2021). He was a Si Valley IC designer at National Semiconductor Corp. before joining the academia. His research covers electron devices, analog/mixed-signal and RF ICs, design-for-reliability, 3D heterogeneous integration, emerging nano devices and circuits, and LED visible light communications. He published two books and 300+ papers, and holds sixteen U.S. patents. He has been IEEE Distinguished Lecturer for IEEE Electron Devices Society, IEEE Circuits and Systems Society and IEEE Solid-State Circuits Society. He was President of IEEE Electron Devices Society. He was Chair for the IEEE CAS Analog Signal Processing Technical Committee. His other committee services include the International Technology Roadmap for Semiconductor (ITRS) Committee, IEEE Heterogeneous Integration Roadmap (HIR) Committee, IEEE 5G Initiatives Committee and IEEE Fellow Committee. He was General Chair of IEEE Electron Devices Technology and Manufacturing (EDTM) Conference (2021) and IEEE Radio-Frequency Integrated Circuits (RFIC) Symposium (2016). Wang is a Fellow of National Academy of Inventors, an IEEE Fellow and an AAAS Fellow.

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'21), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

(1:00:13 + Q&A) Prof. Albert Wang, ECE, University of California, Riverside (invited lecture at Symp on Reliability of Electronics and Photonics Packaging).  Detailed coverage of application of ESD protection to semiconductor protection for heterogeneous integration.

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