Strain and Surface Warping Detection of Interconnect Microstructures via Laser Diffraction

8 views
Download
  • Share
#moire #metrology #laser scanning #IC strain #electronics packaging #stress-strain

(27:40 + Q&A) Prof. Hongbin Yu, Arizona State University.  Metrology for determining stress/strain in IC packaging as a result of thermal differential expansion, with fine detail across a chip or device.

Please visit our website and join our Dlist to access additional presentations on-demand from the Symposium on Reliability of Electronics and Photonics Packaging (REPP).  attend.ieee.org/repp

(27:40 + Q&A) Prof. Hongbin Yu, Arizona State University.  Metrology for determining stress/strain in IC packaging as a result of thermal differential expansion, with fine detail across a chip or device.

Speakers in this video

Advertisment

Advertisment