21st-Century Nano System for Abundant Data Computing

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Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium. Prof. Subhasish Mitra, ECE Department, Stanford University, explains high-density 3D packaging for high-performance computing.

The Fourth Annual Heterogeneous Integration Roadmap Symposium and Annual Meeting, held in Silicon Valley in February 2021, was sponsored by three IEEE Societies (EDS, EPS, and Photonics), as well as ASME and SEMI.

The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia.

The Roadmap is available without charge. Access videos at https://ieee-region6.org/scv-eps/?p=2416.

This presentation introduces the Roadmap and discusses the annual updates.

Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium. Prof. Subhasish Mitra, ECE Department, Stanford University, explains high-density 3D packaging for high-performance computing.

Speakers in this video

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