Electrical Design Of Advanced Packaging In Computing Systems

(47:38 +Q&A)  -- signal integrity, power integrity, methodologies, tools, heterogeneous integration, cores, packaging issues ...  Dr Dale Becker, IBM Corp.
The electrical design of computer systems, which is often called signal integrity and power integrity, is a cross-discipline engineering effort essential to reliable operation of complex systems. This presentation covers the development of electrical techniques, tools, and methodologies as applied to the design of systems over the past 4 decades. These concepts have become the fundamentals on which today’s electrical design methodologies are built. Currently, heterogeneous integration is driving the advancement of systems and increased integration of special processor cores and accelerators has created a challenge as well as a great opportunity for the electrical packaging engineer. Advancing the existing design practices to include co-design of chips and packages, multi-physics analysis with thermal-electrical analysis is a current focus of academic and industry development to achieve a higher level of integration.

Bio: Dr. Dale Becker is a Chief Engineer of Electronic Packaging Integration in IBM Systems, Poughkeepsie, NY. He is responsible for system packaging architecture of IBM Power Systems and System Z including the design of high-speed channels to enable computer system performance and power distribution networks. He has chaired the IEEE EPS Technical Committee on Electrical Modeling, Design, and Simulation and was a Senior Area Editor for the Transactions on CPMT. Dale co-chairs the HIR High-Performance Computing & Data Center Technical Working Group. He is a Technical Committee member for iNEMI. He has been elected an IEEE Fellow.

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