A Framework for the Organization and Execution of the CHIPS Act-related National Advanced Packaging Manufacturing Program

(30:02 + Q&A) Dr. Scott Sikorski, Technology Business Development, IBM Corp.

Index:
-- Forming the NSTC and NAPMP; ASIC
-- U.S. self-sufficiency issues in semiconductor packaging
-- Distribution of advanced packaging worldwide
-- Barriers to entry; consolidation
-- Advanced Packaging workstream organization, membership, build-out
-- Centers of Excellence, technology themes, pilot lines

Dr. Scott Sikorski rejoined IBM in early 2020 with responsibility for growing IBM’s AI hardware partner ecosystem, and is based out the T.J. Watson Research Center. Previously, Dr. Sikorski was with STATS ChipPAC for 10 years during which he held leadership positions in Product Line Management and Business Development before being promoted to head of Corporate Strategy in late 2012. In this role he assisted in the acquisition by JCET Group in 2015 at which point he was named Vice President of Product Technology Marketing. In December 2017, Dr. Sikorski was appointed VP of Group Technology Strategy. Dr. Sikorski served on the Boards of industry organizations iNEMI and MEPTEC for several years. Dr. Sikorski started his career in 1989 with IBM Microelectronics, holding positions in R&D, Manufacturing, Product Line Management, Business Development and Complex Deal Negotiation over a 20-year period. Dr. Sikorski received his Bachelor of Science degree from Columbia University’s School of Engineering and Applied Sciences in Metallurgical Engineering and his Master’s degree and Ph.D. from the Massachusetts Institute of Technology, both in Materials Engineering.

See also Robert Rudnitsky's talk on NIST programs.

For edited videos/slides for the plenary talks and working-group presentations, please visit our Silicon Valley EPS chapter's website: https://r6.ieee.org/scv-eps/?p=3049