How the Semiconductor Research Corporation (SRC) is Leading Research in Packaging

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Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium, by John Oakley, a Science Director at SRC, focused on leading Hardware Security, Packaging, Automotive Electronics, and Intelligent Cognitive Assistant research.

The Fourth Annual Heterogeneous Integration Roadmap Symposium and Annual Meeting, held in Silicon Valley in February 2021, was sponsored by three IEEE Societies (EDS, EPS, and Photonics), as well as ASME and SEMI.

The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia.

The Roadmap is available without charge. Access videos at https://ieee-region6.org/scv-eps/?p=2416.

Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium, by John Oakley, a Science Director at SRC, focused on leading Hardware Security, Packaging, Automotive Electronics, and Intelligent Cognitive Assistant research.

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