Introduction: Sixth Annual Symposium on Heterogeneous Integration

74 views
Download
  • Share
Create Account or Sign In to post comments
#heterogeneous integration #advanced packaging #chiplets #roadmap

(19:37) Dr. William (Bill) Chen, ASE, and the co-chair of the IEEE/ASME/SEMI Heterogeneous Integration Roadmap.
Index:
-- Introduction to the Symposium
-- Profile of the HI Roadmap
-- Current Working Group chairs
-- Advance of Chiplets
-- Current developments

William Chen (Bill) holds the position of ASE Fellow & Senior Technical Advisor at ASE Group. Prior to joining ASE, he was Director at the Institute of Materials Research & Engineering (IMRE) in Singapore, following a distinguished career at IBM Corporation. Bill is a past President of the IEEE Electronics Packaging Society. He is a Life Fellow of IEEE and a Fellow of ASME. He received the ASME InterPACK Achievement Award in 2007. In 2018, he received the IEEE Electronics Packaging Field Award, recognizing his contribution to electronic packaging, from research & development through industrialization.
Bill chairs the Heterogeneous Integration Roadmap initiative, co-sponsored by 3 IEEE Societies (EPS, EDS & Photonics) together with SEMI & ASME Electronics & Photonics Packaging Division.

For edited videos/slides for the plenary talks and working-group presentations, please visit our Silicon Valley EPS chapter's website: https://r6.ieee.org/scv-eps/?p=3049

(19:37) Dr. William (Bill) Chen, ASE, and the co-chair of the IEEE/ASME/SEMI Heterogeneous Integration Roadmap.
Index:
-- Introduction to the Symposium
-- Profile of the HI Roadmap
-- Current Working Group chairs
-- Advance of Chiplets
-- Current developments ....

Speakers in this video

Advertisment

Advertisment