Packaging And Interconnect Technologies For Cryogenic And Quantum Systems

Over the past several years, we have been developing an array of packaging and integration technologies for cryogenic, superconducting and quantum systems. These technologies include thin-film, flexible superconducting microwave transmission line cables and cable-to-cable connector technologies that can enable densely integrated cryogenic electronics systems. Rigid or hand-formable co-axial cables, that are used in present systems, are bulky and often limit the integration of a large density of input/output signals into cryogenic environments, due to system constraints including volume and thermal load. Suitable connector technologies are an urgent need for these systems, as well. In this talk, I will describe our research and development efforts to realize high performance, multi-conductor superconducting flexible cables and connectors made using thin-film processing techniques. I’ll also discuss our efforts and the associated challenges with characterizing superconducting cables with extremely low insertion loss at multiple 10’s of GHz. The flexible superconducting cables that we are developing show great promise as interconnect structures for future superconducting and cryogenic electronics systems, including superconducting quantum computing applications.