Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects

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#lead-free solder #constitutive equations #creep #temperature #strain rate #testing #data analysis #acceleration factors #mean life #Anand #Wises #Norton #Garofalo

(1:48:56)  Dr. John H Lau, Unimicron Technology  -- lead-free solder, constitutive equations, creep, temperature, strain rate, testing, data analysis, acceleration factors, mean life ...
Recent advances and trends in lead-free solder joint reliability are presented, with emphasis placed on the design for reliability (DfR) and reliability testing and data analysis. For DfR: (a) the Norton power creep constitutive equations and examples for Au20Sn, Sn58Bi, Sn3.8Ag0.7Cu, and others; (b) the Wises two power creep constitutive equations and examples for Sn3.5Ag and Sn4Ag0.5Cu, (c) the Garofalo hyperbolic sine creep constitutive equations and examples for Sn3.5Ag, Sn3Ag0.5Cu, Sn3.9Ag0.6Cu and others; and (d) the Anand viscoplasticity constitutive equations and examples for Sn3.5Ag, Sn3Ag0.5Cu, Sn3.8Ag0.7Cu and others with temperature and strain rate-dependent parameters, and Sn1Ag0.5Cu, Sn2Ag0.5Cu, Sn3Ag0.5Cu, and Sn4Ag0.5Cu after extreme aging will be discussed. For reliability testing and data analysis: (a) the Weibull and lognormal life distributions for lead-free solder joints under thermal-cycling and drop tests; (b) the true Weibull slope, true characteristic life, and true mean life; and (c) the linear acceleration factors for various lead-free solder alloys based on: (i) frequency and maximum temperature, (ii) dwell time and maximum temperature, and (iii) frequency and mean temperature will be presented. Some recommendations will also be provided.

John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging and SMT assembly, has published more than 515 peer-reviewed papers (375 are the principal investigator), 40 issued and pending US patents (25 are the principal inventor), and 23 textbooks (all are the first author) on, e.g., , Through-Silicon Via (TSV) for 3D Integration (McGraw-Hill, 2013), 3D IC Integration and Packaging (McGraw-Hill, 2016), Fan-Out Wafer-Level Packaging (Springer, 2018), Heterogeneous Integration (Springer, 2019), Semiconductor Advanced Packaging (Springer, 2021), and Chiplet Design and Heterogeneous Integration Packaging (Springer, 2023). John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow, and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.

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(1:48:56)  Dr. John H Lau, Unimicron Technology  -- lead-free solder, constitutive equations, creep, temperature, strain rate, testing, data analysis, acceleration factors, mean life ...
Recent advances and trends in lead-free solder joint reliability are presented, with emphasis placed on the design for reliability (DfR) and reliability testing and data analysis. For DfR: (a) the Norton power creep constitutive equations and examples for Au20Sn, Sn58Bi, Sn3.8Ag0.7Cu, and others; (b) the Wises two power creep constitutive equations and examples ...

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