Co-Design Methodology for Reliable 3D-Integrated DWDM Silicon Photonics

27 views
Download
  • Share
#advanced packaging #photonics packaging #SiPh #SiPho #24-channel receiver #photonics co-design #16 Gbps #power integrity

(24:20 + Q&A) Dr. Jinsung Youn, Hewlett-Packard Enterprise.

To achieve high aggregate bandwidth with lower latency and better energy efficiency, a dense wavelength division multiplexing (DWDM)-based Silicon Photonics (SiPh) is being considered as a key enabler in data centers and high-performance computing system applications. In particular, to develop a reliable DWDM SiPh system, multi-physics design and simulation with electromagnetic, thermal, and optical are strongly required as optical characteristics of thermally-sensitive photonic devices such as ring resonators and photodetectors can be affected. In this talk, we present signal and power integrity (SI/PI) and thermal-aware photonic simulation for a 3D-integrated DWDM SiPh system. 

For other presentations at the Symposium on Reliability of Electronics and Photonics Packaging, please visit our website:  attend.ieee.org/repp, and join our IEEE Dlist.

(24:20 + Q&A) Dr. Jinsung Youn, Hewlett-Packard Enterprise. 

To achieve high aggregate bandwidth with lower latency and better energy efficiency, a dense wavelength division multiplexing (DWDM)-based Silicon Photonics (SiPh) is being considered as a key enabler in data centers and high-performance computing system applications...

Speakers in this video

Advertisment

Advertisment