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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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Showing 1 - 22 of 141
00:45:41
Using Glass Carriers for Precision Wafer Thinning and Warpage Control
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00:31:36
Packaging Challenges in Quantum Computing
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00:44:46
High-Bandwidth and Low-Latency Standardized Interconnect for an Open Chiplet Ecosystem
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00:28:51
Heterogeneous Integration Platform for Next Generation Computing ('Beyond Moore')
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00:38:49
Basic Research in Microelectronics
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00:34:41
A Framework for the Organization and Execution of the CHIPS Act-related National Advanced Packaging Manufacturing Program
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00:33:31
A Roadmap for Heterogeneous Integration for the Next Decade and Beyond – An Academic Perspective
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00:31:36
Heterogeneous Integration Development: Interdisciplinary Innovations
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00:19:37
Introduction: Sixth Annual Symposium on Heterogeneous Integration
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00:28:12
Update on the CHIPS Research and Development Programs
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00:32:51
Submicron Nanosecond Thermoreflectance Imaging for Thermal and Failure Analysis
453 views
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01:48:56
Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects
492 views
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00:13:51
Challenges and Recent Perspectives of 3D Heterogeneous Integration
91 views
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00:13:40
Grain Orientation, Microstructure Evolution and Fatigue Life Prediction of Solder Joints under Thermal Shock Test for Fan-out Wafer Level Packaging
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00:37:36
Thermal and Failure Analysis of Advanced Microelectronic Devices
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00:39:52
Quality and Reliability Assessment of Sintered Nanoporous-Copper Interconnects on Substrates
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00:19:39
Thermal Oscillations and Reliability for Capillary-driven Boiling in Microporous Wicks
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00:20:31
Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling
415 views
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00:41:32
Interconnect Reliability: From the Chip to the System
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00:48:02
Reliability Outlook and Challenges for Monolithic SiPh Applications in Foundary Viewpoint
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00:25:38
Failure-Oriented-Accelerated-Tests (FOATs) and their Roles in Making a Viable IC Package into a Reliable Product
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00:23:00
Multiphysics Approach to Reliability Prediction of Integrated Circuits Due to Radiation Induced Failures
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