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Scalable Highly-Integrated Photonics Packaging for the 5G World: From Datacenters to Drones
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The Origins of Silicon Valley (draft)
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Package Technology, Design, And Methodology Challenges And Solutions For High Bandwidth Electronic Systems
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Electromigration Failure of Solder Interconnects under Non-DC Conditions
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Scalable Highly-Integrated Photonics Packaging for the 5G World: From Datacenters to Drones
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Bonding Technology for the Next Generation Integration Schemes
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The Origins of Silicon Valley: Why and How It Happened, and Lessons for Tech Hubs
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Working Group Meeting 3: 2021 IEEE Heterogeneous Integration Roadmap
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Working Group Meeting 4: 2021 IEEE Heterogeneous Integration Roadmap
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Working Group Meeting 2: 2021 IEEE Heterogeneous Integration Roadmap
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Working Group Meeting 1: 2021 IEEE Heterogeneous Integration Roadmap
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Wrap-up & Charge to the Heterogeneous Integration Roadmap Teams
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Architectures & Business Aspects of Heterogeneous Integration
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Thermal Sciences for the Heterogeneous Future
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Accelerating Electronics & Photonics Innovation for Revolutionary Microsystems
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Reimagining Co-design of HPC Systems for a Heterogeneous Future
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21st-Century Nano System for Abundant Data Computing
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The Future of Microelectronics After the Pandemic
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IEEE Heterogeneous Integration Roadmap Working Groups: Extended Q&A
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IEEE Heterogeneous Integration Roadmap: HIR 2020 Retrospective
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