Workshop at REPP: The IEEE Heterogeneous Integration Roadmap

14 views
Download
  • Share

(1:13:02) Introduction to the IEEE/ASME/SEMI Heterogeneous Integration Roadmap, with a focus on electronics/photonics packaging.  Three talks: 00:00: HIR Overview (Bill Chen, ASE, HIR Co-Chair); 26:00: Modeling/Simulation (Prof. Xuejun Fan, Lamar Univ); 46:08: Ensuring Reliability (Prof. Abhijit Dasgupta, U-Md)

To download chapters of the 2021 Heterogeneous Integration Roadmap (no cost), visit https://eps.ieee.org/hir

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'21), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

(1:13:02) Introduction to the IEEE/ASME/SEMI Heterogeneous Integration Roadmap, with a focus on electronics/photonics packaging.  Three talks: 00:00: HIR Overview (Bill Chen, ASE, HIR Co-Chair); 26:02: Modeling/Simulation (Prof. Xuejun Fan, Lamar Univ); 46:08: Ensuring Reliability (Prof. Abhijit Dasgupta, U-Md)

Speakers in this video

Advertisment

Advertisment