Introduction of ISPG Method and Geometric Multiscale Modeling for Electronics Solder Reflow and Shock Wave Analysis

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#modeling #solder interconnects #micro-bumps #reliability #solder reflow modeling

(24:14 + Q&A) Dr. Dandan Lyu, ANSYS Livermore Software Technology. 

A multiscale computational approach for linking the information of mesoscale dissimilar solder ball geometries to the macroscale drop shock of a PCB is developed. Numerical examples demonstrate that the proposed implicit ISPG formation is able to accurately and efficiently predict the solder reflow profile.

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(24:14 + Q&A) Dr. Dandan Lyu, ANSYS Livermore Software Technology. 

A multiscale computational approach for linking the information of mesoscale dissimilar solder ball geometries to the macroscale drop shock of a PCB is developed.....

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