Additive Manufacturing: Packaging Applications and Growth Needs for Heterogeneous Integration Impact

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#Additive manufacturing #electronics packaging #substrates

(41.28 + Q&A) Kris Erickson, Materials Research Manager, Meta Reality Labs Research -- current practices, materials, capabilities, HI applications, challenges ...
Summary: This talk profiles many of the current/future additive technologies, and covers major developments within additive manufacturing as applied towards electronics packaging needs generally and especially for heterogeneous integration applications, as well as overview the benefits and growth needs for these manufacturing approaches to have impact within our future electronic devices.

Kris Erickson is a Materials Research Manager at Meta Reality Labs Research, based in Redmond, Washington, where he leads a team developing materials for the next generation of Mixed Reality devices. Kris received his PhD in Chemistry at UC-Berkeley, was a post-doctoral appointee at Sandia National Labs’ Materials Physics group, and was a Research Scientist and Manager at HP Labs where he researched and lead teams developing novel solutions in the spaces of Polymer 3D Print, Metal 3D Print, and 3D Printed Electronics.

(41.28 + Q&A) Kris Erickson, Materials Research Manager, Meta Reality Labs Research -- current practices, materials, capabilities, HI applications, challenges ...
Summary: This talk profiles many of the current/future addititve technologies, and covers major developments within additive manufacturing as applied towards electronics packaging needs generally and especially for heterogeneous integration applications, as well as overview the benefits and growth needs for these manufacturing approaches to have impact within our future electronic devices....

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