Working Group Meeting 1: 2021 IEEE Heterogeneous Integration Roadmap

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#advanced packaging #heterogeneous integration #5G #photonics #3D integration #thermal #test #new materials #SiP #2.5D

Presentations and discussion from the 2021 IEEE Heterogeneous Integration Roadmap Symposium, for these chapters: High-Performance Computing; 2D-3D & Interconnects; Thermal Management; Integrated Photonics; Test Technologies; and Cyber Security.

The Fourth Annual Heterogeneous Integration Roadmap Symposium and Annual Meeting, held in Silicon Valley in February 2021, was sponsored by three IEEE Societies (EDS, EPS, and Photonics), as well as ASME and SEMI.

The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia.

The Roadmap is available without charge. Access videos of talks and three more panels/discussions at https://ieee-region6.org/scv-eps/?p=2416.

Presentations and discussion from the 2021 IEEE Heterogeneous Integration Roadmap Symposium, for these chapters: High-Performance Computing; 2D-3D & Interconnects; Thermal Management; Integrated Photonics; Test Technologies; and Cyber Security.

Speakers in this video

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